Micro-stencils are small stencils used mainly for BGA rework. They are designed so that precise amount of solder paste can be applied to single BGA footprint on populated assemblies.

Our Micro-stencil design is flexible enough to operate with a dedicated BGA rework systems as well as for any other Components for Manual assembly.

All of our Micro stencils are provided with custom squeegee blade fabricated precisely to fit the particular Micro-stencil.

Other uses for Micro-stencils include IC and QFP rework, Short Runs for Small Prototypes & Flux Application.